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◆ 製程能力 |
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Item |
摩太(MOTAC) |
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General |
Special |
製程能力公差表
Technical Ability
(Process) Data |
線寬公差
line wide Dimension |
Pitch < 150um |
±0.03 |
±0.02 |
|
Pitch > 150um |
±0.05 |
±0.03 |
|
總跨距公差 Accumlated Pitch |
|
±0.05 |
±0.05 |
孔徑公差
Hole Dimension |
鑽孔 Drill |
±0.03 |
±0.03 |
|
沖型 Punch |
±0.1 |
±0.05 |
外型公差
Outline Dimension |
鋼模 Hard Tooling |
±0.1 |
±0.05 |
|
刀模 Soft Tooling |
±0.5 |
±0.3 |
|
蝕刻刀模 Etch Tooling |
±0.15 |
±0.1 |
沖製公差
Punching |
孔至孔公差 Hole to Hole |
±0.15 |
±0.1 |
|
孔至邊公差 Hole to Edge |
±0.15 |
±0.1 |
|
線路中心至邊公差 Conduct to Edge |
±0.1 |
±0.07 |
|
曲率半徑公差 Radius Dimension |
±0.15 |
±0.15 |
加工偏移
Assembly Accuracy |
貼合公差 (AD)Binding Dimension |
±0.5 |
±0.3 |
|
±0.5 |
±0.3 |
|
±0.5 |
±0.3 |
|
±0.5 |
±0.3 |
|
金手指裸露偏移 Gold Finger Exposure Area |
±0.5 |
±0.3 |
成品總厚度
Total Thickness |
材料總厚度 Material |
±0.05 |
±0.03 |
|
零件插拔端厚度 Components |
±0.03 |
±0.03 |
油墨偏移
Silk Screen |
烘烤型 Toast |
±0.5 |
±0.3 |
|
曝光型 Exposure |
±0.3 |
±0.15 |
|
文字 Silk |
±0.5 |
±0.3 |
|
打件公差 SMT Dimension |
±0.2 |
±0.2 |
線路設計(Pattern Design)
線寬/線距(Min. L/S)
導通孔(Via Pad Size) |
單面板 Single Side |
|
0.04 |
|
雙面板 Double Side |
|
0.04 |
|
外層 Via Pad (mm) |
|
0.3 |
|
內層 Via Pad |
|
0.4 |
|
Solder Pad 距離線路 |
|
0.15 |
最小孔徑
Hole Diameter(Smallest) |
機械鑽孔 CNC Drilling |
|
|
0.1 |
|
沖製下料 Punching Hole |
|
|
Ψ0.8 |
|
軟板層數(FPC layers) |
|
6 |
|
軟硬複合板層次(Rigid-Flex layers) |
|
6 |
表面黏著技術
(Surface Tratment) |
SMT Connector(pitch) |
|
0.4 |
|
SMT 被動元件 |
|
0201 |
|
IC Bonding Capability |
|
0.3 |
|
電鍍錫銅 Tin/Copper Plating (um) |
|
2~10 |
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電鍍鎳金 Gold Plating (um) |
Ni |
|
2~8 |
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Au |
|
0.03~0.4 |
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化學鎳金 Immersion Gold (um) |
Ni |
|
2~6 |
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Au |
|
0.03~0.15 |
網印厚度
Silk Screen Thickness |
銀漿 Silver Paste (um) |
|
10~30 |
|
防焊 Solder Mask (um) |
|
6~18 |
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異方性導電膠 ACP (um) |
|
13~30 |
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