| Item | 摩太(MOTAC) | |||
| General | Special | |||
|
製程能力公差表 Technical Ability (Process) Data |
線寬公差 line wide Dimension |
Pitch < 150um | ±0.03 | ±0.02 |
| Pitch > 150um | ±0.05 | ±0.03 | ||
| 總跨距公差 Accumlated Pitch | ±0.05 | ±0.05 | ||
|
孔徑公差 Hole Dimension |
鑽孔 Drill | ±0.03 | ±0.03 | |
| 沖型 Punch | ±0.1 | ±0.05 | ||
|
外型公差 Outline Dimension |
鋼模 Hard Tooling | ±0.1 | ±0.05 | |
| 刀模 Soft Tooling | ±0.5 | ±0.3 | ||
| 蝕刻刀模 Etch Tooling | ±0.15 | ±0.1 | ||
|
沖製公差 Punching |
孔至孔公差 Hole to Hole | ±0.15 | ±0.1 | |
| 孔至邊公差 Hole to Edge | ±0.15 | ±0.1 | ||
| 線路中心至邊公差 Conduct to Edge | ±0.1 | ±0.07 | ||
| 曲率半徑公差 Radius Dimension | ±0.15 | ±0.15 | ||
|
加工偏移 Assembly Accuracy |
貼合公差 (AD)Binding Dimension | ±0.5 | ±0.3 | |
| ±0.5 | ±0.3 | |||
| ±0.5 | ±0.3 | |||
| ±0.5 | ±0.3 | |||
| 金手指裸露偏移 Gold Finger Exposure Area | ±0.5 | ±0.3 | ||
|
成品總厚度 Total Thickness |
材料總厚度 Material | ±0.05 | ±0.03 | |
| 零件插拔端厚度 Components | ±0.03 | ±0.03 | ||
|
油墨偏移 Silk Screen |
烘烤型 Toast | ±0.5 | ±0.3 | |
| 曝光型 Exposure | ±0.3 | ±0.15 | ||
| 文字 Silk | ±0.5 | ±0.3 | ||
| 打件公差 SMT Dimension | ±0.2 | ±0.2 | ||
|
線路設計(Pattern Design) 線寬/線距(Min. L/S) 導通孔(Via Pad Size) |
單面板 Single Side | 0.04 | ||
| 雙面板 Double Side | 0.04 | |||
| 外層 Via Pad (mm) | 0.3 | |||
| 內層 Via Pad | 0.4 | |||
| Solder Pad 距離線路 | 0.15 | |||
|
最小孔徑 Hole Diameter(Smallest) |
機械鑽孔 CNC Drilling | 0.1 | ||
| 沖製下料 Punching Hole | Ψ0.8 | |||
| 軟板層數(FPC layers) | 6 | |||
| 軟硬複合板層次(Rigid-Flex layers) | 6 | |||
|
表面黏著技術 (Surface Tratment) |
SMT Connector(pitch) | 0.4 | ||
| SMT 被動元件 | 0201 | |||
| IC Bonding Capability | 0.3 | |||
| 電鍍錫銅 Tin/Copper Plating (um) | 2~10 | |||
| 電鍍鎳金 Gold Plating (um) | Ni | 2~8 | ||
| Au | 0.03~0.4 | |||
| 化學鎳金 Immersion Gold (um) | Ni | 2~6 | ||
| Au | 0.03~0.15 | |||
|
網印厚度 Silk Screen Thickness |
銀漿 Silver Paste (um) | 10~30 | ||
| 防焊 Solder Mask (um) | 6~18 | |||
| 異方性導電膠 ACP (um) | 13~30 | |||